正翻译步骤 8
步骤 8
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Lets take a look at the chips that power all that fancy hardware:
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Samsung K3UH5H5OMM-AGCJ 32 Gb (4 GB) LPDDR4X DRAM, layered over a Qualcomm Snapdragon 845
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Toshiba THGAF8G9T43BAIR 64 GB UFS (NAND flash + controller)
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Avago AFEM-9096 front end module
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Qualcomm Aqstic WCD9341 audio codec
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Maxim MAX77705F PMIC
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Skyworks SKY13716-1 low band front end module
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IDT P9320S wireless power receiver likely similar to the P9320
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