三星盖乐世S9拆解指南

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正翻译步骤 10

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步骤 10

Samsung Galaxy S9 Teardown: 步骤 0 中的图像 1，2

Samsung Galaxy S9 Teardown: 步骤 0 中的图像 2，2

IC Identification, pt. 2:
Maxim Integrated MAX98512 audio amplifier (1st one marked is unconfirmed)
Samsung S2MPB02 camera power management
Samsung S2MPB03 camera power management
Samsung S2DOS05 display power management
Qualcomm D5319 mid-band diversity front-end module
RDA Microelectronics RDA6213N FM transceiver (likely)
Qualcomm QET4100 envelope tracker

+	[* black] IC Identification, pt. 2:
+	[* red] Maxim Integrated MAX98512 audio amplifier (1st one marked is unconfirmed)
+	[* orange] Samsung S2MPB02 camera power management
+	[* yellow] Samsung S2MPB03 camera power management
+	[* green] Samsung S2DOS05 display power management
+	[* light_blue] Qualcomm D5319 mid-band diversity front-end module
+	[* blue] RDA Microelectronics RDA6213N FM transceiver (likely)
+	[* violet] Qualcomm [link\|https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end\|QET4100\|new_window=true] envelope tracker

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