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吸锡泵的使用方法

正翻译步骤 3

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步骤 3
How to Use a Desoldering Pump, Desolder a joint: 步骤 0 中的图像 1,3 How to Use a Desoldering Pump, Desolder a joint: 步骤 0 中的图像 2,3 How to Use a Desoldering Pump, Desolder a joint: 步骤 0 中的图像 3,3
Desolder a joint
  • Do not use the desoldering pump to desolder joints near small surface-mounted (SMT) components. The heat spillover and suction may dislodge the SMT components.

  • Prime the desoldering pump by depressing the plunger.

  • Heat the solder joint until the solder is liquified. To help with heat transfer, add some solder onto the soldering iron's tip.

  • Position the pump's nozzle as close to the molten solder as possible.

  • The nozzle is made of heat-resistant plastic, so don't worry if you occasionally brush the tip with it.

  • Press the side button to activate the pump.

  • Repeat the process until the joint is clean. You can also use solder wick to help soak up any remnant solder.

注意:不要在小型贴片元件(SMT)附近使用吸锡泵,被传导的热量和负压吸力可能会导致SMT脱焊移位。

压下吸锡泵活塞杆,备用。

将焊点的焊锡加热至熔融的液体状态。在烙铁头上挂适量焊锡有助于热能的传导。

将吸锡泵的吸咀尽可能贴近熔融的焊点。

吸咀由耐高温塑料制成,完全足以耐受烙铁头的短时间高温烧烫。

按下侧边钮,吸走熔融的焊锡。

重复以上操作直到焊点清理干净为止。也可以使用吸锡带辅助清除残余的焊锡。

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